ʻO Nepcon Kina 2024

Name: Nepcon Kina
Start: 2024-04-24T09:30:00+08:00
End: 2024-04-26T18:00:00+08:00
Location: Shanghai - Shanghai World Expo Exhibition and Convention Center, Shanghai, China

kakau Noi Hale Laau Accommodation

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From April 24, 2024 until April 26, 2024

At Shanghai - Shanghai World Expo Exhibition and Convention Center, Shanghai, Kina - (Hōʻike Palapala ʻāina)

[pale ʻia ka leka uila]

+ 86 21 2231 7010

(E ʻoluʻolu e nānā i nā lā a me nā wahi ma ka pūnaewele mana ma lalo nei ma mua o ka hele ʻana.)

https://www.nepconchina.com/en-gb.html

Māhele: Uila & uila

Nā huaʻōlelo: Nā mea uila, Kūlana kiʻekiʻe, Uila Uila, Hōʻike ʻenehana, Semiconductors, uilaʻoe, make, Hana uila, PCB, Uila pono uila

NEPCON Kina 2024: Shanghai Electronics, Semiconductor, a me Automation Fair

Build The World of SMT EXHIBITION SCALE (expected) Attendees at All Concurrent Exhibitions All Concurrent Exhibitions. All Concurrent Exhibitions have an Exhibition Area. Activities at All Concurrent Exhibitions. Semiconductor packaging IC Packaging Exhibition area. Welcome to NEPCON China. Be YOU.

ʻO NEPCON China kahi hōʻuluʻulu o nā mea hoʻolako PCBA hoʻonā honua a me nā mea hana uila kiʻekiʻe e hōʻike i ke kaʻina hana piha, kaʻana like i ka ʻike e pili ana i ka lako a me ke koi a hoʻoikaika i ka hoʻomohala ʻoihana.

ʻO NEPCON Kina, ka Honua o SMT, he kumu waiwai ia e hui pū ai i nā mea kūʻai mea hana uila kiʻekiʻe a hāʻawi i nā lawelawe hoʻokūkū kūpono. Kōkua kēia i nā mea hoʻolako PCBA honua e hoʻonui i kā lākou ʻoihana ʻoihana, ʻike i nā manawa hou, hoʻomaikaʻi i ka waiwai o ka brand, a kūkulu pono i nā ʻoihana.

NEPCON Kina 2020: E ʻimi i ka honua o SMT ma NEPCON Kina.

Hāʻawi ʻia ʻo NEPCON Kina i ke kūlana ma ke ʻano he hanana honua i ʻae ʻia e UFI.

ʻO ka papahele hōʻikeʻike kahi kahi e hiki ai i nā ʻoihana ke hoʻonui i ka EUR493 biliona ($ 551 biliona) i ke kūʻai aku i kēlā me kēia makahiki. Hoʻoikaika kēia i nā ʻoihana e hui hou a hoʻōla.

ʻO ka Gala Nui o NEPCON China Spring 2021 e hōʻike ana i kahi wanaʻao hou no ka hana uila.

Ke koi nui nei nā ʻoihana hana uila kiʻekiʻe i ka "packing holomua".

Hōʻike i nā "SiPs, 3D packagings, etc." Nā hoʻonā ʻenehana.

Hana mākou me nā mea hoʻolako alakaʻi honua o ka ʻenehana hoʻopihapiha holomua a me nā ʻenehana hana uila.